Engineer with 4 years of hands-on experience and a results-driven mindset. Specialized in high-volume PCB redesigns, following IPC electrical and manufacturing standards to maintain signal integrity (e.g. QFN, SOIC, QFP, BGA). Led and implemented new product introductions according to design and client requirements regarding the constantly evolving requirements. Experienced in analysis and implementation of analog/digital circuits and mini subsystems (e.g. microcontrollers, PLD, FPGA, using C, Python or C++). Skilled in troubleshooting and identifying root causes of failures. Knowledge in product and component life cycle; evaluating critical components for redesigns or replacements following UL/CE standards. Experience with design validation plans, DFMEAs and hardware specs and technical documentation. Strong time-management and organizational skills for coordinating projects that involve cross-functional worldwide teams and mentored apprentices.