Tomás Alonso Villegas Mendoza

• Streamlined manufacturing processes, resulting in reduced production times and increased output.
• Improved production efficiency implementing process improvements increasing yield and reducing scrap
• Mentored junior engineers, fostering a culture of continuous improvement within the team.
• Led cross-functional teams for successful new product launches within tight deadlines.
• Reviewed products for compliance with Design for Manufacturing (DFM) requirements.

Manufacture of PCBs. Launch of NPI for SMT automotive (Tesla). Design of tooling (Stencil, Printer Plates, Fixtures, Pokayokes), Thermal profiling for SMT reflow oven with vacuum. Launch of NPI for 5% solder VOID achievement. Automotive documentation for NPIs (Tesla). CAD and TGZ file managment. Creation of Machine programs. DEK Printer, Camalot Glue Dispenser, Koh-Young solder inspection, Fuji, Rehm Vacuum Reflow Oven, Vitronix Reflow oven, YJ Link conveyors, Router asys, PVA conformal. Gage RR, use of minitab for DOE and screening Design, obtaining and documentation of machine CPKs . Continuous improvement of Scrap, Yield, Downtime.

Manufacture of PCB. Launch of NPIs (SMT and TH) for medical sector. Creation, process and approval of medical documentation IQ, OQ and PQ. Gage RR, use of Minitab for screening design and DOE (Basic), Obtaining of machine CPK. Design of tooling (Stencil, Printer plate, fixtures, poka yokes, wave solder and selective solder pallets). Use of KPO for KohYoung-Dek. Creation of machines programs. DEK Printer, Vitronix reflow oven, Koh-Young solder inspection, Fuji, Electrovert Wave Solder, ERSA, Selective Solder. CAD and TGZ files. Kayzen Projetcs. Management of metrics (Scrap, Machine expenses).

Provided floor support in the process of PCB through-hole soldering process for wave solder and selective solder. Solution of manufacturing solder process for PCBs. Intern project: Implementation of SPC software for Wave Solder, training of personnel for PSC software use.

• Performed diagnostic and troubleshooting procedures to find and identify root causes of mechanical and electrical issues.
• Interpreted drawings and schematics to pinpoint sources of mechanical issues.