Carlos Alberto Couoh Perez
Summary
Accomplished Senior Engineer at Infineon Technologies with over 20 years of expertise in die bond processes. Proven track record in enhancing operational efficiency and resolving chronic solder issues. Skilled in new product development and mentoring teams, driving successful project outcomes through innovative process design and effective collaboration.
Overview
18
18
years of professional experience
Work History
Senior Engineer
Infineon Technologies
06.2009 - Current
- Die Bond experienced process engineer whit more that 20 years of experience for die bond equipment and processes (Soft solder, die attach and solder diffusion). Collaborated on design projects, learning engineering principles and software tools.
- Assisted in troubleshooting technical issues with process and equipment in regards to solder issues.
- Determined equipment failure root cause and implemented solutions.
- Supported senior engineers in developing project documentation and reports.
- Mentored junior engineers, providing guidance in best practices and fostering professional growth opportunities.
Process Engineer
Sharp Electronics
01.2008 - 06.2009
- Developed and implemented process improvements to enhance operational efficiency.
- Designed experiments to validate process changes and ensure compliance with quality standards.
- Managed project timelines and resources to ensure successful completion of engineering initiatives.
Education
Electronic Engineer - Electronic Engineering
Instituto Tecnologico De Tijuana
Tijuana, Baja California, Mexico06-2002
Skills
Die Bond Engineering Process Design for Soft Solder, Die attach and solder diffusion processes
New product development
Safe launch running for production release of new product
Chronics die bond/ die attach/ solder diffusion issues improvements
Timeline
Senior Engineer
Infineon Technologies
06.2009 - Current
Process Engineer
Sharp Electronics
01.2008 - 06.2009
Electronic Engineer - Electronic Engineering
Instituto Tecnologico De Tijuana
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